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Military & Aerospace Electronics
July 2006
Standards-Based Technology Liquid Cooling Parker Hannifin built an advanced standards-based technology liquid cooling demonstrator for high-power embedded electronics applications to support manufacturers and users of open-system architectures. mark for My Articles similar articles
Military & Aerospace Electronics
May 2009
J.R. Wilson
Electronic thermal management is heading to the wall Systems designers who are used to boosting electronic system performance by adding ever-more transistors may have to rethink their design approaches. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Courtney E. Howard
Hot components and cool enclosures Systems architects and integrators are tackling the issues of military electronics survivability with clever chassis designs. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Michael R. Palis
Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers. mark for My Articles similar articles
Military & Aerospace Electronics
May 2006
J.R. Wilson
The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex. mark for My Articles similar articles
Military & Aerospace Electronics
July 2005
John Keller
Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board. mark for My Articles similar articles
Military & Aerospace Electronics
February 2007
John McHale
Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out. mark for My Articles similar articles
The Motley Fool
October 30, 2006
Jack Uldrich
IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency. mark for My Articles similar articles
Military & Aerospace Electronics
March 2006
Heat Sinks Deliver High Performance in Low-Airflow Conditions Advanced Thermal Solutions is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions. mark for My Articles similar articles
Military & Aerospace Electronics
August 2006
John McHale
Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating. mark for My Articles similar articles
Military & Aerospace Electronics
October 2005
Method of heat removal is critical in design Far too often cooling is an afterthought in the design of the latest "black box" and by the time it is parameters such as power, volume, and weight are all at a premium. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Vette Corp. Offers Liquid Cooling for High-Power Electronics Components Electronics cooling specialist Vette Corp. is offering Aluma-Cop liquid cooling for insulated gate bipolar transistors (IGBTs). mark for My Articles similar articles
Military & Aerospace Electronics
December 2006
John Keller
Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths. mark for My Articles similar articles
Military & Aerospace Electronics
February 2008
Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications. mark for My Articles similar articles
Military & Aerospace Electronics
June 2005
John McHale
Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips. mark for My Articles similar articles
Military & Aerospace Electronics
April 2006
Heat Sinks for Low-Airflow Conditions Advanced Thermal Solutions has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today's condensed electronic packages. mark for My Articles similar articles
IEEE Spectrum
November 2008
Monica Heger
IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers mark for My Articles similar articles
IEEE Spectrum
January 2009
Willie D. Jones
Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip mark for My Articles similar articles
Military & Aerospace Electronics
May 2009
CSPI selects SprayCool cooling for deployments in harsh environments Engineers at CSP Inc.'s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company's FastCluster product line. mark for My Articles similar articles
IndustryWeek
February 1, 2004
John Teresko
Helping Electronics Keep Their Cool New thermal-management technology doesn't need cooling fans, say Georgia Tech researchers. mark for My Articles similar articles
Science News
February 10, 2007
Science Safari: Electronics Recycling The Electronics Industry Alliance's recycling Web site provides an online guide to electronics recyclers and disposal options across the United States. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Courtney E. Howard
Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging. mark for My Articles similar articles
Food Engineering
September 1, 2006
Air and gas filters Compressed air and gas filters for harsh environments and aggressive conditions. mark for My Articles similar articles
Military & Aerospace Electronics
December 2007
John Keller
Cost-Sensitive Military Pressures Power Supply Makers to Shrink and Ruggedize COTS Devices Manufacturers of power electronics for military and aerospace applications say they are under pressure to shrink device size and keep a lid on prices, as well as to ruggedize and integrate off-the-shelf components. mark for My Articles similar articles
Military & Aerospace Electronics
July 2007
Ben Kuster
CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects. mark for My Articles similar articles
InternetNews
August 15, 2007
Andy Patrizio
A Mighty Wind's a Blowin' at Purdue Researchers at Purdue University have developed a new method of semiconductor cooling that could improve the cooling rate inside computers by as much as 250 percent. mark for My Articles similar articles
Military & Aerospace Electronics
January 2006
Randy Banton
Evolving COTS cooling for military environments A new 6U infrastructure for air cooling and conduction cooling which is extensible to 3U systems, spray-cooling and liquid-flow-through cooling systems, will enable broader use of commercial off-the-shelf systems. mark for My Articles similar articles
Military & Aerospace Electronics
November 2007
John McHale
Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers. mark for My Articles similar articles
CIO
January 1, 2007
Robert Mullins
Throw Cold Water on Data Center Costs IBM will license its technology for cooling servers with water instead of air to Panduit, a global networking and electrical manufacturer, hoping to encourage adoption of IBM energy-saving techniques for data centers. mark for My Articles similar articles
BusinessWeek
October 4, 2004
Stephen H. Wildstrom
Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers. mark for My Articles similar articles
The Motley Fool
January 20, 2012
Seth Jayson
Parker Hannifin Meets on Revenue, Misses on EPS For the quarter ended Dec. 31, Parker Hannifin met expectations on revenue and missed on earnings per share. mark for My Articles similar articles
IEEE Spectrum
January 2008
Alexander Hellemans
Thermal Transistor: The World's Tiniest Refrigerator Thermal transistors refrigerate one electron at a time and physicists plan to compute with heat. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John McHale
Military Technologies Conference a Hit Among Attendees Lead-free issues, International Traffic in Arms Regulations (ITARs), and thermal management were three important issues discussed at this year's MTC conference. mark for My Articles similar articles
InternetNews
July 25, 2007
David Needle
HP's Green Data Center Portfolio Keeps Growing HP introduced Thermal Zone Mapping, a new technology designed to identify trouble spots in the data center in terms of energy efficiency. mark for My Articles similar articles
Chemistry World
July 10, 2012
Coolant to put electric cars in the fast lane Battery temperature is critical for performance and safety, but it's a tricky business cooling the large batteries needed for electric vehicles. Now, scientists in Germany have developed a new coolant which promises to cool batteries on hot days. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Tom Litrenta
Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent Early thermal simulations helped C-MAC MicroTechnology discovered that junction temperatures on a stacked module ranged up to 125 degrees and needed increased thermal resistance. mark for My Articles similar articles
The Motley Fool
December 2, 2004
Steven Mallas
Amazon's Electrifying Sales Amazon.com apparently has greater sales in electronics than books for the very first time. mark for My Articles similar articles
Military & Aerospace Electronics
September 2005
Ram Rajan
Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer. mark for My Articles similar articles
This Old House
November 2007
Max Alexander
Geothermal Heat Pump For the ultimate in comfort and energy conservation, start by digging a hole. mark for My Articles similar articles
National Defense
March 2011
Eric Beidel
Microwave Weapon Designed to Render Electronics Useless The Air Force wants to disable enemy electronics without harming nearby buildings or people. mark for My Articles similar articles
The Motley Fool
January 18, 2007
Rich Duprey
Parker Hannifin's in Control: Fool by Numbers The motion control systems manufacturer released second-quarter 2007 earnings: Income Statement Highlights... Margin Checkup... Balance Sheet Highlights... Cash Flow Highlights... mark for My Articles similar articles
Chemistry World
May 1, 2015
Tim Wogan
Exploding batteries caught on camera Researchers have tracked the thermal runaway of lithium-ion batteries, using high-speed computed tomography and radiography together with thermal imaging to work out what goes on inside the batteries as they overheat. mark for My Articles similar articles
Fast Company
September 2010
A 31-Year Look at Mark Parker's Nike Career How Mark Parker helped create Nike's success. mark for My Articles similar articles
Military & Aerospace Electronics
March 2008
John McHale
Managing Thermal Efficiency of Modern Processors Discussed at Military & Aerospace Electronics Forum Current and future-generation processors are creating escalating thermal demands on military designers. mark for My Articles similar articles
Military & Aerospace Electronics
August 2006
Chip-on-Flex Filter Connector Withstands Thermal Shock and Vibration The ITT Industries Electronic Components segment is offering the Cannon Chip on Flex (CoF) filter technology that reduces stress from thermal shock and vibration while protecting sensitive electronics in a lightweight package. mark for My Articles similar articles
AskMen.com Holiday Gift Guide 2013: Fashion From electronics to socks, there is something for everyone on the list. mark for My Articles similar articles