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Military & Aerospace Electronics May 2008 Courtney E. Howard |
Hot components and cool enclosures Systems architects and integrators are tackling the issues of military electronics survivability with clever chassis designs.  |
Military & Aerospace Electronics May 2006 J.R. Wilson |
The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage.  |
Military & Aerospace Electronics May 2007 John Keller |
Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex.  |
Military & Aerospace Electronics May 2008 Michael R. Palis |
Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers.  |
Military & Aerospace Electronics April 2009 Courtney E. Howard |
Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging.  |
Military & Aerospace Electronics July 2009 |
Parker Offers Liquid Cooling for High-Power Electronic Thermal Management Parker Hannifin is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics.  |
Military & Aerospace Electronics July 2005 John Keller |
Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create.  |
Military & Aerospace Electronics April 2008 Courtney E. Howard |
Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments.  |
Military & Aerospace Electronics April 2008 Courtney E. Howard |
Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out.  |
Military & Aerospace Electronics May 2007 John Keller |
Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board.  |
Military & Aerospace Electronics February 2007 John McHale |
Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston.  |
Military & Aerospace Electronics June 2005 John McHale |
Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips.  |
Military & Aerospace Electronics January 2006 Randy Banton |
Evolving COTS cooling for military environments A new 6U infrastructure for air cooling and conduction cooling which is extensible to 3U systems, spray-cooling and liquid-flow-through cooling systems, will enable broader use of commercial off-the-shelf systems.  |
Military & Aerospace Electronics December 2006 John Keller |
Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths.  |
Military & Aerospace Electronics February 2008 |
Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications.  |
IEEE Spectrum January 2009 Willie D. Jones |
Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip  |
Military & Aerospace Electronics September 2008 Courtney E. Howard |
A Voracious Need for Vectronics Military end users have an increasing demand for computing and networking performance in packages that are ever smaller, lighter, and more power efficient  |
Military & Aerospace Electronics June 2009 Courtney E. Howard |
Electronics miniaturization Nanotechnology and MEMS are ideal for mil-aero applications, given the increasing need for small, light weight, and low-power solutions.  |
Military & Aerospace Electronics August 2006 John McHale |
Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating.  |
IndustryWeek February 1, 2004 John Teresko |
Helping Electronics Keep Their Cool New thermal-management technology doesn't need cooling fans, say Georgia Tech researchers.  |
The Motley Fool October 30, 2006 Jack Uldrich |
IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency.  |
Military & Aerospace Electronics July 2007 Ben Kuster |
CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects.  |
Military & Aerospace Electronics September 2005 Ram Rajan |
Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer.  |
Military & Aerospace Electronics March 2009 Keith Gurnett & Tom Adams |
Up next: through-silicon vias The excitement over TSVs has been caused by the enhancement in process speed that can be gained by shortening distances.  |
Military & Aerospace Electronics May 2009 |
CSPI selects SprayCool cooling for deployments in harsh environments Engineers at CSP Inc.'s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company's FastCluster product line.  |
Military & Aerospace Electronics September 2009 Courtney E. Howard |
Advanced Vetronics: Hit the Ground Running Industry heeds the warfighter's call for innovative, responsive, and reliable electronics in combat vehicles on the ground.  |
Military & Aerospace Electronics June 2006 Gurnett & Adams |
Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications.  |
Military & Aerospace Electronics May 2008 |
Products Martek Power offers high-power, multichannel power modules... Aeroflex offers Battery Electronic Unit family of Li-Ion cell balancing products... Elmo offers board-mounted servo drive with 5 kilowatts continuous power... etc.  |
Military & Aerospace Electronics January 2006 Ben Ames |
Rugged Computers Power the Digital Battlefield Troops are pushing rugged computers harder than ever, as manufacturers seek tougher display screens, more reliable hard drives, and faster processors. A major challenge for engineers is to keep pace with fast upgrades in COTS technology.  |
Military & Aerospace Electronics December 2005 Powers & Penglase |
Using DC-DC Converters in Mobile-Based Ground Equipment As designers incorporate increasing amounts of sophisticated electronics into industrial and military vehicle-based applications, high-density DC-DC converters have evolved to keep pace.  |
Military & Aerospace Electronics January 2010 |
Microelectronics Thermal Management Device From Nextreme Meets MIL-STD 883 Shock Standard An advanced heat-pumping thermoelectric device for electronics thermal management from Nextreme Thermal Solutions has passed the 3000-G shock test as defined in the 2002 mechanical shock standard.  |
Military & Aerospace Electronics April 2006 |
Heat Sinks for Low-Airflow Conditions Advanced Thermal Solutions has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today's condensed electronic packages.  |
Military & Aerospace Electronics December 2007 John Keller |
Cost-Sensitive Military Pressures Power Supply Makers to Shrink and Ruggedize COTS Devices Manufacturers of power electronics for military and aerospace applications say they are under pressure to shrink device size and keep a lid on prices, as well as to ruggedize and integrate off-the-shelf components.  |
IEEE Spectrum November 2008 Monica Heger |
IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers  |
Military & Aerospace Electronics November 2007 John McHale |
Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers.  |
BusinessWeek October 4, 2004 Stephen H. Wildstrom |
Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers.  |
IEEE Spectrum December 2007 Joshua J. Romero |
Carbon Nanotubes Take the Heat Off Chips Purdue scientists find flexible filaments best.  |
Scientific American October 2008 Steven Ashley |
Cool Polymers: Toward the Microwave Oven Version of the Refrigerator Getting a bigger chill out of polymers that respond to electric fields.  |
Defense Update Issue 2, 2007 |
Infantry's Survival Gear New trends in infantry gear: The myriad of threats in today's battlefields requires a holistic approach to personal protection.  |
Military & Aerospace Electronics April 2009 Tom Litrenta |
Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent Early thermal simulations helped C-MAC MicroTechnology discovered that junction temperatures on a stacked module ranged up to 125 degrees and needed increased thermal resistance.  |
This Old House November 2007 Max Alexander |
Geothermal Heat Pump For the ultimate in comfort and energy conservation, start by digging a hole.  |
CIO March 1, 2003 Christopher Lindquist |
Low-Heat Laptops You won't be able to use your laptop as a portable coffee warmer anymore, if technology from Sandia National Laboratories goes mainstream.  |
Chemistry World July 10, 2012 |
Coolant to put electric cars in the fast lane Battery temperature is critical for performance and safety, but it's a tricky business cooling the large batteries needed for electric vehicles. Now, scientists in Germany have developed a new coolant which promises to cool batteries on hot days.  |
Popular Mechanics April 2007 Anthony Verducci |
How to Install a Computer Water Cooling System Forget fans. If your computer's CPU runs hot and heavy, it may be time to give it a bath.  |
Military & Aerospace Electronics March 2006 |
Heat Sinks Deliver High Performance in Low-Airflow Conditions Advanced Thermal Solutions is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions.  |
Military & Aerospace Electronics May 2008 Courtney E. Howard |
Military programs adopt SprayCool liquid-cooled electronics enclosure for harsh environments The EFV is designed to assist Marines in combat by making the most of tactical surprise, minimizing vulnerability on land, and improving firepower, lethality, and survivability.  |
InternetNews October 20, 2006 Drew Robb |
Storage Turns Power Hungry The growing demand for storage capacity has brought with it power and cooling issues.  |
Military & Aerospace Electronics October 2004 |
The move to lead-free solders has its own challenges and hidden problems Peak reflow temperature increases and the imperfectly known characteristics of new materials lie at the core of the problem. Will the new finish layer on the lead frame adhere well to the epoxy? Will the epoxy stick to the die face?  |
Military & Aerospace Electronics June 2004 John McHale |
ISR Ships SprayCool Aft Power Supply for Flight-Testing The first SprayCool aft power supply for aircraft applications has passed flight-testing in the U.S. Navy's EA-6B Prowler electronic warfare aircraft.  |
CIO April 15, 2006 Susannah Patton |
Powering Down Electricity-hungry equipment, combined with rising energy prices, are devouring data center budgets. Here's what you can do to get costs under control.  |