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Military & Aerospace Electronics
May 2008
Courtney E. Howard
Hot components and cool enclosures Systems architects and integrators are tackling the issues of military electronics survivability with clever chassis designs. mark for My Articles similar articles
Military & Aerospace Electronics
May 2006
J.R. Wilson
The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Michael R. Palis
Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Courtney E. Howard
Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging. mark for My Articles similar articles
Military & Aerospace Electronics
July 2009
Parker Offers Liquid Cooling for High-Power Electronic Thermal Management Parker Hannifin is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics. mark for My Articles similar articles
Military & Aerospace Electronics
July 2005
John Keller
Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board. mark for My Articles similar articles
Military & Aerospace Electronics
February 2007
John McHale
Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston. mark for My Articles similar articles
Military & Aerospace Electronics
June 2005
John McHale
Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips. mark for My Articles similar articles
Military & Aerospace Electronics
January 2006
Randy Banton
Evolving COTS cooling for military environments A new 6U infrastructure for air cooling and conduction cooling which is extensible to 3U systems, spray-cooling and liquid-flow-through cooling systems, will enable broader use of commercial off-the-shelf systems. mark for My Articles similar articles
Military & Aerospace Electronics
December 2006
John Keller
Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths. mark for My Articles similar articles
Military & Aerospace Electronics
February 2008
Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications. mark for My Articles similar articles
IEEE Spectrum
January 2009
Willie D. Jones
Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip mark for My Articles similar articles
Military & Aerospace Electronics
September 2008
Courtney E. Howard
A Voracious Need for Vectronics Military end users have an increasing demand for computing and networking performance in packages that are ever smaller, lighter, and more power efficient mark for My Articles similar articles
Military & Aerospace Electronics
June 2009
Courtney E. Howard
Electronics miniaturization Nanotechnology and MEMS are ideal for mil-aero applications, given the increasing need for small, light weight, and low-power solutions. mark for My Articles similar articles
Military & Aerospace Electronics
August 2006
John McHale
Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating. mark for My Articles similar articles
IndustryWeek
February 1, 2004
John Teresko
Helping Electronics Keep Their Cool New thermal-management technology doesn't need cooling fans, say Georgia Tech researchers. mark for My Articles similar articles
The Motley Fool
October 30, 2006
Jack Uldrich
IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency. mark for My Articles similar articles
Military & Aerospace Electronics
July 2007
Ben Kuster
CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects. mark for My Articles similar articles
Military & Aerospace Electronics
September 2005
Ram Rajan
Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer. mark for My Articles similar articles
Military & Aerospace Electronics
March 2009
Keith Gurnett & Tom Adams
Up next: through-silicon vias The excitement over TSVs has been caused by the enhancement in process speed that can be gained by shortening distances. mark for My Articles similar articles
Military & Aerospace Electronics
May 2009
CSPI selects SprayCool cooling for deployments in harsh environments Engineers at CSP Inc.'s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company's FastCluster product line. mark for My Articles similar articles
Military & Aerospace Electronics
September 2009
Courtney E. Howard
Advanced Vetronics: Hit the Ground Running Industry heeds the warfighter's call for innovative, responsive, and reliable electronics in combat vehicles on the ground. mark for My Articles similar articles
Military & Aerospace Electronics
June 2006
Gurnett & Adams
Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Products Martek Power offers high-power, multichannel power modules... Aeroflex offers Battery Electronic Unit family of Li-Ion cell balancing products... Elmo offers board-mounted servo drive with 5 kilowatts continuous power... etc. mark for My Articles similar articles
Military & Aerospace Electronics
January 2006
Ben Ames
Rugged Computers Power the Digital Battlefield Troops are pushing rugged computers harder than ever, as manufacturers seek tougher display screens, more reliable hard drives, and faster processors. A major challenge for engineers is to keep pace with fast upgrades in COTS technology. mark for My Articles similar articles
Military & Aerospace Electronics
December 2005
Powers & Penglase
Using DC-DC Converters in Mobile-Based Ground Equipment As designers incorporate increasing amounts of sophisticated electronics into industrial and military vehicle-based applications, high-density DC-DC converters have evolved to keep pace. mark for My Articles similar articles
Military & Aerospace Electronics
January 2010
Microelectronics Thermal Management Device From Nextreme Meets MIL-STD 883 Shock Standard An advanced heat-pumping thermoelectric device for electronics thermal management from Nextreme Thermal Solutions has passed the 3000-G shock test as defined in the 2002 mechanical shock standard. mark for My Articles similar articles
Military & Aerospace Electronics
April 2006
Heat Sinks for Low-Airflow Conditions Advanced Thermal Solutions has introduced maxiFLOW heat sinks for cooling ball grid arrays and other hot components in the restricted air flow conditions typical of today's condensed electronic packages. mark for My Articles similar articles
Military & Aerospace Electronics
December 2007
John Keller
Cost-Sensitive Military Pressures Power Supply Makers to Shrink and Ruggedize COTS Devices Manufacturers of power electronics for military and aerospace applications say they are under pressure to shrink device size and keep a lid on prices, as well as to ruggedize and integrate off-the-shelf components. mark for My Articles similar articles
IEEE Spectrum
November 2008
Monica Heger
IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers mark for My Articles similar articles
Military & Aerospace Electronics
November 2007
John McHale
Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers. mark for My Articles similar articles
BusinessWeek
October 4, 2004
Stephen H. Wildstrom
Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers. mark for My Articles similar articles
IEEE Spectrum
December 2007
Joshua J. Romero
Carbon Nanotubes Take the Heat Off Chips Purdue scientists find flexible filaments best. mark for My Articles similar articles
Scientific American
October 2008
Steven Ashley
Cool Polymers: Toward the Microwave Oven Version of the Refrigerator Getting a bigger chill out of polymers that respond to electric fields. mark for My Articles similar articles
Defense Update
Issue 2, 2007
Infantry's Survival Gear New trends in infantry gear: The myriad of threats in today's battlefields requires a holistic approach to personal protection. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Tom Litrenta
Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent Early thermal simulations helped C-MAC MicroTechnology discovered that junction temperatures on a stacked module ranged up to 125 degrees and needed increased thermal resistance. mark for My Articles similar articles
This Old House
November 2007
Max Alexander
Geothermal Heat Pump For the ultimate in comfort and energy conservation, start by digging a hole. mark for My Articles similar articles
CIO
March 1, 2003
Christopher Lindquist
Low-Heat Laptops You won't be able to use your laptop as a portable coffee warmer anymore, if technology from Sandia National Laboratories goes mainstream. mark for My Articles similar articles
Chemistry World
July 10, 2012
Coolant to put electric cars in the fast lane Battery temperature is critical for performance and safety, but it's a tricky business cooling the large batteries needed for electric vehicles. Now, scientists in Germany have developed a new coolant which promises to cool batteries on hot days. mark for My Articles similar articles
Popular Mechanics
April 2007
Anthony Verducci
How to Install a Computer Water Cooling System Forget fans. If your computer's CPU runs hot and heavy, it may be time to give it a bath. mark for My Articles similar articles
Military & Aerospace Electronics
March 2006
Heat Sinks Deliver High Performance in Low-Airflow Conditions Advanced Thermal Solutions is offering maxiFLOW heat sinks for cooling ball grid arrays (BGAs) and other hot components in restricted air-flow conditions. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Courtney E. Howard
Military programs adopt SprayCool liquid-cooled electronics enclosure for harsh environments The EFV is designed to assist Marines in combat by making the most of tactical surprise, minimizing vulnerability on land, and improving firepower, lethality, and survivability. mark for My Articles similar articles
InternetNews
October 20, 2006
Drew Robb
Storage Turns Power Hungry The growing demand for storage capacity has brought with it power and cooling issues. mark for My Articles similar articles
Military & Aerospace Electronics
October 2004
The move to lead-free solders has its own challenges and hidden problems Peak reflow temperature increases and the imperfectly known characteristics of new materials lie at the core of the problem. Will the new finish layer on the lead frame adhere well to the epoxy? Will the epoxy stick to the die face? mark for My Articles similar articles
Military & Aerospace Electronics
June 2004
John McHale
ISR Ships SprayCool Aft Power Supply for Flight-Testing The first SprayCool aft power supply for aircraft applications has passed flight-testing in the U.S. Navy's EA-6B Prowler electronic warfare aircraft. mark for My Articles similar articles
CIO
April 15, 2006
Susannah Patton
Powering Down Electricity-hungry equipment, combined with rising energy prices, are devouring data center budgets. Here's what you can do to get costs under control. mark for My Articles similar articles